Carbon nanotube films and microjet cooling devices for thermal management
Abstract/Contents
- Abstract
- The downsizing of electronic devices and the consequent increasing power densities pose thermal management challenges for the semiconductor industry. Since the present thermal solutions limit their cooling capacity, developing new cooling methods for electronic devices has become important. This dissertation presents two types of novel methods for heat dissipation from integrated circuits: One is the use of advanced thermal interface materials, such as carbon nanotubes (CNTs), to increase heat dissipation between the solid and solid surface, such as a chip and heat sink. The second method is the use of a microjet impingement device to improve heat transfer between a liquid and solid in a heat sink. As advanced interface materials, vertically aligned carbon nanotube films are promising because of their unique mechanical and thermal properties. The first part of the dissertation describes the design, fabrication, and testing of CNTs using resonators to characterize their mechanical properties. Discussed in detail is the preparation of carbon nanotubes using different recipes, resulting in varied thicknesses of single-walled carbon nanotube films and multi-walled carbon nanotube films. The measurements of the resonant frequency shifts due to the presence of the CNT films using a laser Doppler vibrometer system result in extracted moduli of 0.5-220 [Mu]m-thick nanotube films varying from 1 to 370 MPa. To show how the physics between the effective modulus and thickness are connected, an analysis for the height dependence of the modulus is provided. After an image analysis is presented, a nanotube dynamics simulation based on tube properties and film morphology is introduced to predict mechanical properties. In addition to discussing the proposed interface materials, the second part of the dissertation describes the design, fabrication and testing of microjet impingement cooling, which display high heat capacities, as an advanced thermal management solution. The design of single-jet and multi-jet arrays with different numbers of diameters, locations, and spacing is discussed. Specifically, this part demonstrates how the microjet hydrodynamics are quantified using two-dimensional images by [Mu]PIV techniques, enabling the reconstruction of the three-dimensional flow field. The results indicate that CNT films offer a mechanical compliance that is suitable for TIM applications and that the microscale liquid jet devices provide quantified flow physics for heat sink applications.
Description
| Type of resource | text |
|---|---|
| Form | electronic; electronic resource; remote |
| Extent | 1 online resource. |
| Publication date | 2011 |
| Issuance | monographic |
| Language | English |
Creators/Contributors
| Associated with | Won, Yoon Jin |
|---|---|
| Associated with | Stanford University, Department of Mechanical Engineering |
| Primary advisor | Kenny, Thomas William |
| Thesis advisor | Kenny, Thomas William |
| Thesis advisor | Goodson, Kenneth E, 1967- |
| Thesis advisor | Pruitt, Beth |
| Advisor | Goodson, Kenneth E, 1967- |
| Advisor | Pruitt, Beth |
Subjects
| Genre | Theses |
|---|
Bibliographic information
| Statement of responsibility | Yoonjin Won. |
|---|---|
| Note | Submitted to the Department of Mechanical Engineering. |
| Thesis | Ph.D. Stanford University 2011 |
| Location | electronic resource |
Access conditions
- Copyright
- © 2011 by Yoon Jin Won
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