Low-power and highly-stable encapsulated MEMS-based clocks
Abstract/Contents
- Abstract
- In today's economy, timing references are everywhere from smart-phones to cars. Timing references or clocks provide a stable signal that serves as a reference for communication between digital systems from processors within a smart-phone to cellphones on a wireless network. In the past decades, quartz clocks have dominated the field of portable timing references, and their size and power consumption have limited the design specifications of electronics and other devices. Recently, encapsulated MEMS-based clocks have entered this market, due to their small size, low cost and low power consumption. The main challenge of MEMS-based clocks is that they are fabricated with silicon, which has elastic properties with a strong linear temperature dependence that contributes to lower frequency stability over temperature. Previous research aimed to solve this problem with temperature compensation techniques including passive methods such as changes in the wafer doping and resonator orientation, and active methods such as ovenization. These methods aimed to reduce the linear relationship between the frequency and temperature characteristic of silicon resonators. These efforts are expanded in this work to demonstrate novel dual-mode MEMS-based clocks with in-chip device layer micro-oven that controls the temperature of the resonators with 10x reduced power consumption and provides more than 30x improved frequency stability when compared to recent results with a micro-oven embedded in the encapsulation layer. This device layer micro-oven enables the correction of ambient temperature fluctuations and achieves long-term frequency stability over temperature of +/- 1.5ppb, which is better than the stability of TCXOs and competes with state-of-the-art quartz OCXOs and miniature atomic clocks, while requiring much less power. This work also explored techniques to improve the yield of devices with micro-ovens embedded in the device layer and the thermal effects of ovenized devices on other sensors located in the same chip.
Description
| Type of resource | text |
|---|---|
| Form | electronic resource; remote; computer; online resource |
| Extent | 1 online resource. |
| Place | California |
| Place | [Stanford, California] |
| Publisher | [Stanford University] |
| Copyright date | 2018; ©2018 |
| Publication date | 2018; 2018 |
| Issuance | monographic |
| Language | English |
Creators/Contributors
| Author | Comenencia Ortiz, Lizmarie |
|---|---|
| Degree supervisor | Kenny, Thomas William |
| Thesis advisor | Kenny, Thomas William |
| Thesis advisor | Howe, Roger Thomas |
| Thesis advisor | Senesky, Debbie |
| Degree committee member | Howe, Roger Thomas |
| Degree committee member | Senesky, Debbie |
| Associated with | Stanford University, Department of Mechanical Engineering. |
Subjects
| Genre | Theses |
|---|---|
| Genre | Text |
Bibliographic information
| Statement of responsibility | Lizmarie Comenencia Ortiz. |
|---|---|
| Note | Submitted to the Department of Mechanical Engineering. |
| Thesis | Thesis Ph.D. Stanford University 2018. |
| Location | electronic resource |
Access conditions
- Copyright
- © 2018 by Lizmarie Comenencia Ortiz
- License
- This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).
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