Forming-free nitrogen-doped aluminum oxide resistive random access memory

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Abstract/Contents

Abstract
The persistent request for smaller, faster, cheaper, more capable electronic devices continues to drive the development of technology and to drive the exploration of unique materials to overcome the limits of conventional Si-based technology. Since many modern electronic devices become mobile and multifunctional, they need a new high-density nonvolatile memory overcoming density limitations of currently used flash memory. Bi-stable switching is reported to be observed in a variety of next-generation non-volatile memory technologies such as a resistive random access memory (RRAM), a phase-change random access memory (PRAM), a magnetoresistive random access memory (MRAM) and a ferroelectric random access memory (FeRAM). Among these nonvolatile memories, resistive random access memory (RRAM) is a promising candidate for next-generation nonvolatile memory with higher density than that of flash memory since it is based on a low-temperature grown oxide thin film with bi-stable resistance states and is compatible with three-dimensional stack structure. Among various oxide films exhibiting the resistive switching phenomenon, aluminum oxide (AlOX) is one of the most promising materials because of its simple constituents, clear switching characteristics, and moderate on/off ratio. In addition, since AlOX has a simple binary system, it has an advantage for the industrial fabrication. However, there are some challenges that need to be addressed for the AlOX based RRAM. One of the challenges is that AlOX RRAM cells have been reported to require a high voltage forming process. So, making good quality aluminum oxide film with a moderate amount of defects is a main issue for realizing AlOX RRAM devices. In this dissertation, we present a simple nitrogen-doped AlOX (N-AlOX) RRAM cell that has a moderate amount of defects. The main contribution of this dissertation is a new type of RRAM (N-AlOX RRAM) that does not require a forming process and shows small programming currents. Some switching mechanisms have been proposed to explain the resistance switching phenomenon of AlOX RRAM. However, the underlying mechanism of resistance switching behavior of N-AlOX RRAM has not been understood. So, we perform some material analyses of N-AlOX RRAM in detail to understand the switching mechanism. Next, we discuss various electrical characteristics of N-AlOX RRAM. Based on the electrical characteristics, we present a Frenkel-Poole model for the current conduction mechanism of N-AlOX RRAM. The last topic of this dissertation is titanium oxide (TiOX) based RRAM. We focus on evaluating many electrodes and understanding the impact on the switching characteristics of TiOX RRAM. As a result, we find iridium oxide (IrO2) as a viable electrode for TiOX RRAM. In addition, we successfully improve the uniformity of switching parameters by inserting two hafnium (Hf) interfacial layers. Finally, we conclude this dissertation with a summary of the main points and some suggestions for future work on this topic.

Description

Type of resource text
Form electronic; electronic resource; remote
Extent 1 online resource.
Publication date 2012
Issuance monographic
Language English

Creators/Contributors

Associated with Kim, Wanki
Associated with Stanford University, Department of Electrical Engineering
Primary advisor Wong, S. Simon
Thesis advisor Wong, S. Simon
Thesis advisor Nishi, Yoshio, 1940-
Thesis advisor Wong, Hon-Sum Philip, 1959-
Advisor Nishi, Yoshio, 1940-
Advisor Wong, Hon-Sum Philip, 1959-

Subjects

Genre Theses

Bibliographic information

Statement of responsibility Wanki Kim.
Note Submitted to the Department of Electrical Engineering.
Thesis Thesis (Ph.D.)--Stanford University, 2012.
Location electronic resource

Access conditions

Copyright
© 2012 by Wanki Kim
License
This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).

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