Characterization of failure and energy dissipation mechanisms in MEMS resonators

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Abstract/Contents

Abstract
Silicon microelectromechanical systems (MEMS) resonators are used in many applications, such as inertial sensors and clocks. The performance and sensitivity of these devices are limited by mechanisms that cause failure and energy dissipation. This thesis first characterizes fatigue failure in epitaxially deposited polysilicon and demonstrates ways in which it is accelerated at high temperatures. The second section of this thesis demonstrates ways to manipulate thermoelastic energy dissipation (TED) in MEMS resonators. Different schemes of shape and parameter optimization of the device geometry are explored to show how they reduce the TED and increase performance. Finally the last section of this thesis, demonstrates how a high amplitude driving scheme induces nonlinear energy dissipation, proportional to the squared vibrational amplitude, in MEMS resonators. The source of the nonlinearity is explored to understand how pressure losses and TED could be involved

Description

Type of resource text
Form electronic resource; remote; computer; online resource
Extent 1 online resource
Place California
Place [Stanford, California]
Publisher [Stanford University]
Copyright date 2020; ©2020
Publication date 2020; 2020
Issuance monographic
Language English

Creators/Contributors

Author Alter, Anne Louise
Degree supervisor Kenny, Thomas William
Thesis advisor Kenny, Thomas William
Thesis advisor Howe, Roger Thomas
Thesis advisor Senesky, Debbie
Degree committee member Howe, Roger Thomas
Degree committee member Senesky, Debbie
Associated with Stanford University, Department of Mechanical Engineering.

Subjects

Genre Theses
Genre Text

Bibliographic information

Statement of responsibility Anne Louise Alter
Note Submitted to the Department of Mechanical Engineering
Thesis Thesis Ph.D. Stanford University 2020
Location electronic resource

Access conditions

Copyright
© 2020 by Anne Louise Alter
License
This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).

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