The comparison study of future on-chip interconnects for high performance VLSI applications

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Abstract/Contents

Abstract
Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.

Description

Type of resource text
Form electronic; electronic resource; remote
Extent 1 online resource.
Publication date 2011
Issuance monographic
Language English

Creators/Contributors

Associated with Koo, Kyung Hoae
Associated with Stanford University, Department of Electrical Engineering
Primary advisor Saraswat, Krishna
Thesis advisor Saraswat, Krishna
Thesis advisor Harris, J. S. (James Stewart), 1942-
Thesis advisor Wong, Hon-Sum Philip, 1959-
Advisor Harris, J. S. (James Stewart), 1942-
Advisor Wong, Hon-Sum Philip, 1959-

Subjects

Genre Theses

Bibliographic information

Statement of responsibility Kyung Hoae Koo.
Note Submitted to the Department of Electrical Engineering.
Thesis Ph.D. Stanford University 2011
Location electronic resource

Access conditions

Copyright
© 2011 by Kyung Hoae Koo
License
This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).

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