Temperature compensation of epitaxially encapsulated silicon MEMS resonators

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Abstract/Contents

Abstract
Silicon microelectromechanical systems (MEMS) resonator-based timing references have been considered as a promising alternative to quartz crystal resonators. However, due to the intrinsic temperature coefficient of elasticity (TCE) of silicon, most systems exhibit a linear temperature coefficient of frequency (TCf) of -30ppm/℃. This makes temperature compensation essential for high precision timing reference applications, such as timekeeping, inertial measurement or communication. In this thesis, I will present fabrication techniques and various temperature compensation schemes for achieving high temperature stability of silicon MEMS resonators. First, we will discuss two variations of the baseline wafer-level encapsulation (epi-seal) process to allow large lateral transduction gaps and bottom electrodes, respectively. This enables the fabrication of various kinds of high performance resonating MEMS devices that are not available with the baseline process. The second part of this dissertation will focus on two active temperature compensation schemes based on ovenization, which uses Joule heating to operate the resonator at a fixed temperature. Lastly, we will demonstrate the amplitude-frequency effect of anharmonic coupling between two resonant modes, and a novel passive compensation method that utilizes this phenomenon. Interesting nonlinear dynamics behaviors of 1:2 internal resonance will also be presented and discussed.

Description

Type of resource text
Form electronic; electronic resource; remote
Extent 1 online resource.
Publication date 2017
Issuance monographic
Language English

Creators/Contributors

Associated with Chen, Yunhan
Associated with Stanford University, Department of Mechanical Engineering.
Primary advisor Kenny, Thomas William
Thesis advisor Kenny, Thomas William
Thesis advisor Howe, Roger Thomas
Thesis advisor Senesky, Debbie
Advisor Howe, Roger Thomas
Advisor Senesky, Debbie

Subjects

Genre Theses

Bibliographic information

Statement of responsibility Yunhan Chen.
Note Submitted to the Department of Mechanical Engineering.
Thesis Thesis (Ph.D.)--Stanford University, 2017.
Location electronic resource

Access conditions

Copyright
© 2017 by Yunhan Chen
License
This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).

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