RF-ultrasound relay for wireless powering and communication with retinal and brain implants
Abstract/Contents
- Abstract
- Next generation neural interfaces including retinal and brain implants have the potential to treat vision loss and neurological disorders. To do so effectively, large arrays of electrical stimulation and recording channels are needed to manipulate and capture electrical activity at cellular resolution. To wirelessly power and communicate with these devices, a couple challenges need to be overcome. First, wireless power must pass through two mediums for retinal and brain implants: air and eye tissue, or skull and brain tissue. Current single modality solutions are limited in either depth or by the interface between the two mediums. Second, recording neural activity over a large array generates a huge data volume that needs to be transmitted from the implant. In this work, we will address these two challenges using a new RF-ultrasound relay architecture. First, to overcome the challenge of transmitting across two mediums, the relay architecture uses a combination of RF and ultrasound to overcome the interface loss and to transmit at depth. New rectifier and power amplifier designs are introduced in a custom CMOS chip to increase the power conversion efficiency from RF to ultrasound, and beamforming is implemented to make it more robust to implant movement. Second, we will introduce an implant compatible high data rate uplink. A 12 Mbps uplink ultrasound MIMO system is presented to handle the data volume from the recording array. The MIMO receiver is integrated onto the CMOS chip and is robust to movement and wireless power. The custom CMOS chip integrates both wireless power and data relaying capability to enable these next generation implants.
Description
| Type of resource | text |
|---|---|
| Form | electronic resource; remote; computer; online resource |
| Extent | 1 online resource. |
| Place | California |
| Place | [Stanford, California] |
| Publisher | [Stanford University] |
| Copyright date | 2024; ©2024 |
| Publication date | 2024; 2024 |
| Issuance | monographic |
| Language | English |
Creators/Contributors
| Author | So, Chun-Ming Ernest |
|---|---|
| Degree supervisor | Arbabian, Amin |
| Thesis advisor | Arbabian, Amin |
| Thesis advisor | Chichilnisky, E. J |
| Thesis advisor | Rivas-Davila, Juan |
| Degree committee member | Chichilnisky, E. J |
| Degree committee member | Rivas-Davila, Juan |
| Associated with | Stanford University, School of Engineering |
| Associated with | Stanford University, Department of Electrical Engineering |
Subjects
| Genre | Theses |
|---|---|
| Genre | Text |
Bibliographic information
| Statement of responsibility | Ernest So. |
|---|---|
| Note | Submitted to the Department of Electrical Engineering. |
| Thesis | Thesis Ph.D. Stanford University 2024. |
| Location | https://purl.stanford.edu/hr859vb8804 |
Access conditions
- Copyright
- © 2024 by Chun-Ming Ernest So
- License
- This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).
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