Advancing photonic communication and sensing through novel 3D silicon photonic devices
Abstract/Contents
- Abstract
- From consumer products to specialized technology, it seems like everybody wants devices that are more powerful and yet smaller at the same time. Reliance on metallic devices and components serves to bottleneck any progress towards achieving both goals. One solution is to incorporate photonic technology and especially photonic crystals (PhCs), taking advantage of the speed, efficiency, and lossless nature of photons. PhCs, specifically three-dimensional (3D) PhCs, offer a promise of complete control over light inside a device through photonic band gap (PBG) confinement. But a big obstacle to integrating 3D PhCs into current processing and architecture is fabrication. Fabricated 3D PhCs (prior to this author's work in 2019) are not developed in a way that is considered silicon-compatible (Si-compatible) - using methodology that would fit into already-established silicon processing methods. Before widespread integration can be realized, a highly-customizable Si-compatible method for developing 3D photonic devices needs to be introduced. This dissertation explores the world of PhCs, offering novel fabrication methods and analyses of 3D silicon PhC devices. Both pure bulk 3D PhC structures and 3D PhC defect devices are examined, using theory and literature to provide a solid foundation and then building upon that foundation with new and innovative designs. The first truly Si-compatible fabrication of a 3D PhC is explored, yielding a wide omnidirectional and complete band gap. Then by introducing intentional defects into the device and still maintaining Si-compatible methodology, this thesis provides an avenue for a breadth of research applications to use 3D PhC defect devices that control light through PBG confinement.
Description
| Type of resource | text |
|---|---|
| Form | electronic resource; remote; computer; online resource |
| Extent | 1 online resource. |
| Place | California |
| Place | [Stanford, California] |
| Publisher | [Stanford University] |
| Copyright date | 2021; ©2021 |
| Publication date | 2021; 2021 |
| Issuance | monographic |
| Language | English |
Creators/Contributors
| Author | Tietz, Stephanie |
|---|---|
| Degree supervisor | Saraswat, Krishna |
| Thesis advisor | Saraswat, Krishna |
| Thesis advisor | Miller, D. A. B |
| Thesis advisor | Vuckovic, Jelena |
| Degree committee member | Miller, D. A. B |
| Degree committee member | Vuckovic, Jelena |
| Associated with | Stanford University, Department of Electrical Engineering |
Subjects
| Genre | Theses |
|---|---|
| Genre | Text |
Bibliographic information
| Statement of responsibility | Stephanie Tietz. |
|---|---|
| Note | Submitted to the Department of Electrical Engineering. |
| Thesis | Thesis Ph.D. Stanford University 2021. |
| Location | https://purl.stanford.edu/gp949ws9524 |
Access conditions
- Copyright
- © 2021 by Stephanie Tietz
- License
- This work is licensed under a Creative Commons Attribution Non Commercial 3.0 Unported license (CC BY-NC).
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